“integrated circuit”的概念、定义、翻译、参考文献-科学参考

integrated circuit

Physics

A miniature electronic circuit produced within a single crystal of a semiconductor, such as silicon. They range from simple logic circuits, little more than 1 mm square, to large-scale circuits measuring up to 8 mm square and containing a million or so transistors (active components) and resistors or capacitors (passive components). They are widely used in memory circuits, microcomputers, pocket calculators, and electronic watches on account of their low cost and bulk, reliability, and high speed. They are made by introducing impurities into specific regions of the semiconductor crystal by a variety of techniques.

Computer

An implementation of a particular electronic-circuit function in which all the individual devices required to realize the function are fabricated on a single chip of semiconductor, usually silicon. The individual devices normally consist of semiconductor diodes, transistors, and resistors.
In MOS integrated circuits the active devices are MOSFETs, which operate at low currents and high frequencies. A very large number of MOSFETs can be packed together on one silicon chip, i.e. MOS circuits have a high packing density. They also consume very little power. The development of MOS technology has allowed extremely complex functions to be performed on a single chip.
In bipolar integrated circuits the components are bipolar transistors and other devices that are fabricated using the p-n junction properties of semiconductors. Compared with MOS circuits, bipolar circuits have higher operating speeds but have the disadvantages of high power consumption and low packing density. They are also less simple to fabricate than MOS circuits.
The improvement in the fabrication technology of integrated circuits has made possible the construction of a huge number of components on a single chip. These may be combined on the chip to make a wide variety of digital and analogue circuits. The complexity of a digital circuit produced on a single chip is usually described in terms of the number of transistors involved, or sometimes of the number of logic gates. This formerly led to the following differentiation:
- VLSI very large-scale integration
- LSI large-scale integration
- MSI medium-scale integration
- SSI small-scale integration
These terms are now not widely used because all modern chips are VSLI.
Digital integrated circuits are often represented by their logic function rather than their electronic function in order to ease their understanding. See also hybrid integrated circuit.

Electronics and Electrical Engineering

A complete circuit, including active and passive electronic devices and their interconnections, that is made on a single substrate. A hybrid integrated circuit consists of several separate component parts attached to a ceramic substrate and interconnected either by wire bonds or a suitable metallization pattern. The individual parts are unencapsulated and may consist of diffused or thin-film components or one or more monolithic circuits. An IC is much smaller than a circuit made from discrete packaged components and once fabricated an individual component cannot be altered without destroying the entire circuit.
A monolithic integrated circuit has all the circuit components made into or on top of a single chip of semiconductor. The components are then connected by one or more levels of metallization deposited onto the surface of the IC in an appropriate pattern (see multilevel metallization). Making the circuit directly in the semiconductor enables circuits and structures to be made, and electronic functions to be generated, that would be impossible to realize in discrete form. This is because the reliability of the many individual components required for the circuit is not sufficient to allow the complex circuit formed therefrom to be guaranteed to operate, whereas using the same technology the reliability of the complete IC would be similar to that of each component.
Silicon is used in the majority of commercial integrated circuits. Bipolar integrated circuits are based on bipolar junction transistors, and are used for high-speed analogue and digital circuits and for lowest-noise ICs. MOSFETs are used in the highest-density ICs, such as microprocessors and memory ICs, as the small size and low power consumption of the individual transistors permit very complex circuits to be made. Combinations of technologies are used in particular applications; for example, BiCMOS technology combines bipolar transistors for output power capability and CMOS transistors for logic operation, while BiFET technology combines bipolar circuits with JFETs for low-noise high-speed analogue ICs. Gallium arsenide is used for monolithic microwave integrated circuits (MMICs) for specialist applications at microwave frequencies.
The complexity of a (digital) monolithic IC is described by the number of components that form the circuit; often this is counted in terms of the number of logic gates per IC. SSI (small-scale integration) refers to simple circuits of up to about ten components; many GaAs MMICs fall into this category. MSI (medium-scale integration) describes circuits of 10–100 components. LSI (large-scale integration) refers to circuits of 100 to a few thousand gates; many high-speed silicon and GaAs digital circuits are LSI. VLSI (very large scale integration) describes all ICs that are larger than a few thousand gates; this includes almost all microprocessors, memory, and digital signal processing ICs currently available. Gate counts in high-end commercial multicore processors now exceed billions of gates.
https://learn.sparkfun.com/tutorials/integrated-circuits A tutorial on integrated circuits, on the sparkfun website

单词	integrated circuit
释义	integrated circuit Physics A miniature electronic circuit produced within a single crystal of a semiconductor, such as silicon. They range from simple logic circuits, little more than 1 mm square, to large-scale circuits measuring up to 8 mm square and containing a million or so transistors (active components) and resistors or capacitors (passive components). They are widely used in memory circuits, microcomputers, pocket calculators, and electronic watches on account of their low cost and bulk, reliability, and high speed. They are made by introducing impurities into specific regions of the semiconductor crystal by a variety of techniques. Computer An implementation of a particular electronic-circuit function in which all the individual devices required to realize the function are fabricated on a single chip of semiconductor, usually silicon. The individual devices normally consist of semiconductor diodes, transistors, and resistors. In MOS integrated circuits the active devices are MOSFETs, which operate at low currents and high frequencies. A very large number of MOSFETs can be packed together on one silicon chip, i.e. MOS circuits have a high packing density. They also consume very little power. The development of MOS technology has allowed extremely complex functions to be performed on a single chip. In bipolar integrated circuits the components are bipolar transistors and other devices that are fabricated using the p-n junction properties of semiconductors. Compared with MOS circuits, bipolar circuits have higher operating speeds but have the disadvantages of high power consumption and low packing density. They are also less simple to fabricate than MOS circuits. The improvement in the fabrication technology of integrated circuits has made possible the construction of a huge number of components on a single chip. These may be combined on the chip to make a wide variety of digital and analogue circuits. The complexity of a digital circuit produced on a single chip is usually described in terms of the number of transistors involved, or sometimes of the number of logic gates. This formerly led to the following differentiation: VLSI very large-scale integration LSI large-scale integration MSI medium-scale integration SSI small-scale integration These terms are now not widely used because all modern chips are VSLI. Digital integrated circuits are often represented by their logic function rather than their electronic function in order to ease their understanding. See also hybrid integrated circuit. Electronics and Electrical Engineering A complete circuit, including active and passive electronic devices and their interconnections, that is made on a single substrate. A hybrid integrated circuit consists of several separate component parts attached to a ceramic substrate and interconnected either by wire bonds or a suitable metallization pattern. The individual parts are unencapsulated and may consist of diffused or thin-film components or one or more monolithic circuits. An IC is much smaller than a circuit made from discrete packaged components and once fabricated an individual component cannot be altered without destroying the entire circuit. A monolithic integrated circuit has all the circuit components made into or on top of a single chip of semiconductor. The components are then connected by one or more levels of metallization deposited onto the surface of the IC in an appropriate pattern (see multilevel metallization). Making the circuit directly in the semiconductor enables circuits and structures to be made, and electronic functions to be generated, that would be impossible to realize in discrete form. This is because the reliability of the many individual components required for the circuit is not sufficient to allow the complex circuit formed therefrom to be guaranteed to operate, whereas using the same technology the reliability of the complete IC would be similar to that of each component. Silicon is used in the majority of commercial integrated circuits. Bipolar integrated circuits are based on bipolar junction transistors, and are used for high-speed analogue and digital circuits and for lowest-noise ICs. MOSFETs are used in the highest-density ICs, such as microprocessors and memory ICs, as the small size and low power consumption of the individual transistors permit very complex circuits to be made. Combinations of technologies are used in particular applications; for example, BiCMOS technology combines bipolar transistors for output power capability and CMOS transistors for logic operation, while BiFET technology combines bipolar circuits with JFETs for low-noise high-speed analogue ICs. Gallium arsenide is used for monolithic microwave integrated circuits (MMICs) for specialist applications at microwave frequencies. The complexity of a (digital) monolithic IC is described by the number of components that form the circuit; often this is counted in terms of the number of logic gates per IC. SSI (small-scale integration) refers to simple circuits of up to about ten components; many GaAs MMICs fall into this category. MSI (medium-scale integration) describes circuits of 10–100 components. LSI (large-scale integration) refers to circuits of 100 to a few thousand gates; many high-speed silicon and GaAs digital circuits are LSI. VLSI (very large scale integration) describes all ICs that are larger than a few thousand gates; this includes almost all microprocessors, memory, and digital signal processing ICs currently available. Gate counts in high-end commercial multicore processors now exceed billions of gates. https://learn.sparkfun.com/tutorials/integrated-circuits A tutorial on integrated circuits, on the sparkfun website
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