A method used during the packaging of integrated circuits to connect the chip to the leadframe. The leadframe is formed by stamping the interconnection pattern required from a strip of thin copper sheeting. The chip is positioned in a small depression in the centre and the leads connected to the bonding pads of the chip using individual wire bonds. In the case of packages with ceramic casings, the leadframe is mounted in the package before the chip is bonded in place. For plastic packages, the chip is bonded to the leadframe and then encapsulated in moulded plastic. The finished package may be in the form of a pin grid array, leadless chip carrier, or dual in-line package. Compare tape-automated bonding.