A form of package used for integrated circuits that is capable of providing up to several hundred connections to one chip and is used for LSI and VLSI applications. It consists of a ceramic or moulded plastic casing that contains a leadframe. The leadframe is connected to the bonding pads of the chip using either wire bonding or tape automated bonding, and is connected to an array of output pins around the edges of the PGA package. The grid array of pins may be formed as several parallel rows of pins at two opposite sides of the package or around all four sides of the package, depending on the size and complexity of the integrated circuit. See also dual in-line package; leadless chip carrier.