“晶圆级封装发光二极管切割”的概念、定义、翻译、参考文献-科学参考

单词	晶圆级封装发光二极管切割
释义	晶圆级封装发光二极管切割 Encyclopedia 工学发光二极管封装工艺释 wafer level packaging light emitting diode cutting晶圆级封装发光二极管切割对发光二极管整个晶圆进行封装测试，再进行切割而得到单个成品芯片的工艺过程。
随便看	injection molding for ceramics injection molding machine injection molding of rubber injection morphism injection moulding machine injection of internal hemorrhoid injection plugging injection point distance injection production ratio injection profile logging injections injections of pegylated proteins injection source injection therapy of withered hemorrhoid injection valve injection volume injection welding injection well string injective injective A-module injective Banach space injective C*-algebra injective class injective dimension injective dimension of a module

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。