“晶圆级封装发光二极管切割”的概念、定义、翻译、参考文献-科学参考

单词	晶圆级封装发光二极管切割
释义	晶圆级封装发光二极管切割 Encyclopedia 工学发光二极管封装工艺释 wafer level packaging light emitting diode cutting晶圆级封装发光二极管切割对发光二极管整个晶圆进行封装测试，再进行切割而得到单个成品芯片的工艺过程。
随便看	Blaschke product Blaschke-Santaló inequality Blaschke selection theorem Blaschke sequence Blaschke's kinematic formula Blaschke theorem Blaschke-Weyl formula Blas Galindo Blashko effect Blasingame decline curve Blasius Blasius boundary layer Blasius differential equation BLAST blast blast burn blast burner blast cell blast containment chamber blast diversion fuse-plug emergency spillway Blasted blastema blast furnace blast furnace break blast furnace campaign life for a continuous period

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。