“晶圆级封装发光二极管切割”的概念、定义、翻译、参考文献-科学参考

单词	晶圆级封装发光二极管切割
释义	晶圆级封装发光二极管切割 Encyclopedia 工学发光二极管封装工艺释 wafer level packaging light emitting diode cutting晶圆级封装发光二极管切割对发光二极管整个晶圆进行封装测试，再进行切割而得到单个成品芯片的工艺过程。
随便看	fluid retention fluid retention at diaphragm fluid saturation fluid seismic detection fluid seismic exploration fluid simulation fluid-solid coupling fluid-solid interaction fluid solid interactions fluid-solid separation fluid-solid-thermal coupled mechanics fluid static mechanics fluid statics fluid statics, hydrostatics fluid statistical thermodynamics fluid surface fluid suspension culture fluid test fluid torque converter fluid traversing a single pipe fluid viscosity fluidzed bed reactor fluitante fluke flume

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。