“晶圆级封装发光二极管切割”的概念、定义、翻译、参考文献-科学参考

单词	晶圆级封装发光二极管切割
释义	晶圆级封装发光二极管切割 Encyclopedia 工学发光二极管封装工艺释 wafer level packaging light emitting diode cutting晶圆级封装发光二极管切割对发光二极管整个晶圆进行封装测试，再进行切割而得到单个成品芯片的工艺过程。
随便看	unmodulated groove unmount unmovable cultural relics unmyelinated nerve fibre unnamed number Unnamed Society unnatural amino acid unnatural base unnatural death unnatural nucleotide Unnelling and Underground Space Technology unnotched unnotched specimen unnumbered unnumbered asteroid unnumbered frame unobservable unobservable parameter unobservable quantity unobservable subspace unobstructed deformation unobstructed moduli space unobtrusive research unoccupied unoccupied band

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。