“晶圆级封装发光二极管切割”的概念、定义、翻译、参考文献-科学参考

单词	晶圆级封装发光二极管切割
释义	晶圆级封装发光二极管切割 Encyclopedia 工学发光二极管封装工艺释 wafer level packaging light emitting diode cutting晶圆级封装发光二极管切割对发光二极管整个晶圆进行封装测试，再进行切割而得到单个成品芯片的工艺过程。
随便看	character module character of a group character of an Abelian group character of an algebra character of an algebraic group character of a regular chain character of a representation character of a representation of a group character of a semigroup character of a topological group character of a topological space character of a unitary representation character of discontinuity character of isotropy character of symmetric operation character-oriented protocol character person switching character printer characterpulse character recognition character rendering character retrieval character ring character segmentation character semigroup

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。