A very small volume package for an active device, for use in high-frequency circuits. The packages are usually made from ceramic materials, which have well-toleranced dielectric properties, designed to minimize parasitic capacitance. The packages also have very short connecting leads to minimize the parasitic inductance. This enables the active devices to operate close to their maximum frequency of operation. Examples include small-outline diode, IC, and transistor packages – SOD, SOIC, and SOT, respectively.