A circuit that is manufactured by thick-film techniques, such as silk screen printing, and usually contains only passive components and interconnections. A thick film, up to about 20 micrometres thick and composed of a suitable glaze or cement, such as a ceramic/metal alloy, is deposited on a glass or ceramic substrate; the desired pattern for interconnections and passive components is then produced on it. Thick-film circuits may be used to form hybrid integrated circuits: silicon chips containing active components or devices are wire bonded to the film circuit to form the completed circuit, which is then packaged.