“thermal resistance”的概念、定义、翻译、参考文献-科学参考

thermal resistance

Chemical Engineering

The resistance of a body to transmit thermal energy. It is the ratio of the driving force to the rate of heat transfer. A lagged pipe carrying a hot fluid has thermal resistances that include convective resistance on the inside of the pipe, resistance due to conductivity of the pipe wall material, resistance due to the lagging material, convective resistance on the outside of the pipe, and possibly the resistance to heat transfer due to fouling on the inner pipe wall surface. It has SI units m² K W⁻¹.

Electronics and Electrical Engineering

1. The ratio of the difference in temperature between two specified points to the heat flow between these points, under thermal equilibrium conditions.
2. In a semiconductor device, the ratio of the temperature difference between a region in the device and the ambient temperature to the power dissipation in the device. The thermal resistance of the device depends on the material used and the geometry of the device and affects the ease of cooling the device.

单词	thermal resistance
释义	thermal resistance Chemical Engineering The resistance of a body to transmit thermal energy. It is the ratio of the driving force to the rate of heat transfer. A lagged pipe carrying a hot fluid has thermal resistances that include convective resistance on the inside of the pipe, resistance due to conductivity of the pipe wall material, resistance due to the lagging material, convective resistance on the outside of the pipe, and possibly the resistance to heat transfer due to fouling on the inner pipe wall surface. It has SI units m² K W⁻¹. Electronics and Electrical Engineering 1. The ratio of the difference in temperature between two specified points to the heat flow between these points, under thermal equilibrium conditions. 2. In a semiconductor device, the ratio of the temperature difference between a region in the device and the ambient temperature to the power dissipation in the device. The thermal resistance of the device depends on the material used and the geometry of the device and affects the ease of cooling the device.
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