A method used during the packaging of integrated circuits, usually when a large number of interconnections (over 100) is required between the chip and the leadframe. The leadframe is formed from plated copper on a strip of plastic (the tape), and extends to reach the bonding pads of the chip. Metal bumps are formed at the points to be connected to the bonding pads, and the pads themselves have metallic caps formed on them by sputtering. The chip is positioned on the tape and all the bonds formed simultaneously by thermal compression. The process is automated by producing the tape as a long strip of successive leadframes. The bonded assemblies are then encapsulated in moulded plastic and separated to produce the finished packages. The packages may have the form of pin grid arrays, leadless chip carriers, or dual in-line packages. Compare wire bonding.