“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	oceanic nitrogen cycle oceanic oscillation oceanic oxic event oceanic rare earth resource survey oceanic red beds oceanic rise oceanic sounding equipment oceanic system oceanic water mass change oceanic whitecaps ocean interfacial waves ocean internal wave oceanium ocean-land carbon reservoir exchange ocean lidar ocean literature ocean magnetology ocean meteorological hazards ocean mixing Ocean modeling and simulation ocean observation system of magnetic diurnal variation ocean observation technology ocean observing information system oceanographic data oceanographic lidar

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