“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	semiaxis semi-balanced lattice square semi-barium star semi-basic differential form semi-bilinear semi bilinear form semi-bilinear form semi-bilinear form; sesquilinear form semi-bilinear functional semi-bilinear mapping semi-bipartite graph semi bituminous coal semi-bituminous coal semi-bounded semi-bounded from above semi-bounded from below semi-boundedness semi-bounded operator semi-bounded transformation semibreadth semibreve semibridging carbonyl semibridging group semi-bright coal semicanonical equations

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