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direct wafer bonding technology
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direct wafer bonding technology
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direct wafer bonding technology
直接晶圆键合技术
晶圆表面无须外加黏结剂、焊料或其他辅助材料,通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
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