“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	multivariate analysis multivariate analysis of variance multivariate attribute multivariate binomial distribution multivariate calculus multivariate calibration multivariate compositional data analysis multivariate control chart Multivariate coordinated control method multivariate data multivariate data visualization multivariate discriminant analysis multivariate distribution multivariate distribution function multivariate elliptical distribution multivariate extreme value distribution multivariate failure time data multivariate function multivariate Hermite polynomial multivariate hypergeometric multivariate hypergeometric function multivariate interpolation multivariate Jacobi polynomial multivariate Laguerre polynomial multivariate linear hypothesis

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