“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	harmful air pollutants harmful algal blooms harmful composition harmful consequences harmful elements of plants harmful food additives harmful gas harmful gases in military artificial environments harmful gases in swine building harmful herding harmful information on internet harmful integrated temperature harmful mammals in forest harmful microorganisms in military artificial environments harmful phase precipitated during long term aging of superalloy harmful tissue reaction harmful use harmless treatment of animal debris harmless treatment of livestock manure harmodotron Harmonia Harmonia axyridis harmonic harmonica harmonic addition theorem

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