“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	O. Teichmueller (1913—1943) Otello OTF OTFT Othello Other 3 Billion satellite constellation other abdominal surgical instruments other abnormal combustion technology of engine other adhesives other alloy materials other basic surgical instruments other burn & plastic surgical instruments other carbonization technology Other Collected Writings at the Ministry of Rites other communication disorders other ENT surgical instruments other examinations other family planning instruments other feed additives other fixed assets investment other food additive other foreign investment other gamma ray sources in solor system other microsurgical instruments other neurosurgical intracerebral instruments

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