“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	combination without repetition combination with repetition combination with restricted positions combinative combinative ambigurous segments combinative crime combinative method combinator combinator calculus combinatorial combinatorial active-site saturation test，CAST combinatorial algorithm combinatorial analysis combinatorial analysis situs combinatorial approximation combinatorial auction combinatorial ball combinatorial boundary combinatorial cell combinatorial characteristic Combinatorial Chemistry combinatorial chemistry combinatorial chemistry and compound combinatorial library combinatorial choice problem combinatorial closure

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。