“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	regular circular cylinder regular circumscribed polygon regular class regular class of divisors regular closed curve regular closed set regular closed subspace regular closed ultrafilter regular closure regular cluster regular cluster of galaxies regular coloring regular commutator regular compensation regular complete intersection regular complex function regular component regular composition regular conditional distribution regular conditional probability regular cone regular confidence region regular configuration regular congruence regular conic section

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