计算机硬件 计算机工程制造 释文 dip-soldering 浸焊
- bonding orbital
- bonding pad
- bonding promoter
- bonding properties of wood-based panels
- bonding state
- bonding technology
- bonding technology/technique
- bonding types of organometallic compounds
- bond insurance
- bond issue
- bond length
- bond market
- bond moment
- Bond number
- bond orbital approximation
- bond order
- bond order potential
- bond-orientational order
- bond percolation
- bond percolation process
- bond polarizability
- bond pricing
- bond ratings
- bond reconstruction
- bond selected chemistry