“键合技术”的概念、定义、翻译、参考文献-科学参考

单词	键合技术
释义	键合技术 Encyclopedia 工学［传感器制造］释 bonding technology/technique键合技术通过外界条件作用，实现不同材质或相同材质永久黏合的工艺技术。工学键合技术释 bonding technology键合技术通过物理、化学作用或两者共同作用，将两种相同或不同材料基片紧密黏合在一起的工艺过程。
随便看	charge-transfer absorption spectrum charge transfer coefficient charge transfer complex charge-transfer complex charge transfer complex, CTC charge transfer (CT) charge transfer device charge transfer device, CTD charge-transfer exciton charge transfer initiation charge transfer insulator charge transfer interaction charge-transfer interaction charge transfer overpotential charge transfer polymerization charge transfer process charge transfer reaction charge transfer salt charge-transfer salt charge transfer state charge-transfer state charge transfer state, charge-transfer state charge transfer transition charge transport charge trap flash

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