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硅硅键合
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silicon direct bonding
硅硅键合
将两个表面光滑平整的硅片经化学清洗和等离子活化处理后,在室温下通过表面原子之间的范德华力或氢键结合在一起,再经过高温退火处理,使键合界面发生硅-硅成键化学反应,形成强度很大的化学共价键连接,从而使两个硅片键合为一体的技术。
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