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直接键合
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直接键合
室温下进行粘贴的两晶圆经过高温退火处理直接键合在一起,不需要任何黏结剂和外加电场,且具有良好的结合强度的技术。又称硅熔融键合。
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更新时间:2026/1/22 12:50:12