“直接晶圆键合技术”的概念、定义、翻译、参考文献-科学参考

单词	直接晶圆键合技术
释义	直接晶圆键合技术 Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	production planning and scheduling for mineral processing production planning and scheduling optimization production planning execution system production planning management production planning system production platform production population production price production process production process in ecosystem production process inspection production process of hard-cover binding single machines production process of light olefins production process of vinyl chloride by calcium carbide method production process of vinyl chloride by ethylene method production process quality control production procurement production profile logging production progress meeting production purpose of socialism production rate production rate of furnaces in metallurgical industry production rate of local entropy density production reactor production riser

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。