“直接晶圆键合技术”的概念、定义、翻译、参考文献-科学参考

单词	直接晶圆键合技术
释义	直接晶圆键合技术 Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	Interactional Sociolinguistics interaction among tree species interaction analysis interaction between charged particle and electromagnetic field interaction between climate change and terrestrial ecosystems interaction between electromagnetic wave and atmosphere interaction between genders interaction between high energy electrons and nuclei interaction between ion beam and solid interaction between pantographs and overhead contact line interaction between particle and solid interaction between port and city interaction between rotor and stator interaction between shock wave and boundary layer interaction between shock wave and boundary layer experiment interaction between support and surrounding rock interaction between terahertz wave and matters interaction between wave and floating body interaction between wheel and rail interaction boson fermion model interaction boson model interaction channel capacity interaction coefficient of activity interaction coefficients interaction constant

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。