“直接晶圆键合技术”的概念、定义、翻译、参考文献-科学参考

单词	直接晶圆键合技术
释义	直接晶圆键合技术 Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	plant extract plant extracts plant fibre plant food plant freezing damage plant freezing tolerance plant gene diagnosis plant genetic engeneering plant genetics plant genetic transformation plant geography plant germplasm development plant germplasm resource collection plant group plant growth and development plant growth curve plant growth promoting bacteria,PGPB plant growth promoting rhizobacteria plant growth-promoting rhizobacteria，PGPR plant growth prompting fung plant growth regulator plant growth substance plant habitat microbes plant-herbivore interaction Plant Holly

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。