“直接晶圆键合技术”的概念、定义、翻译、参考文献-科学参考

单词	直接晶圆键合技术
释义	直接晶圆键合技术 Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	introduction of aquatic species introduction of exotic species Introduction of Manchu Script Introduction of Military Geography Introduction of Modern Chinese Lexicon introduction of modern western water conservancy science and technology introduction of museum Introduction of Publishing Science introduction of the conjunction Introduction of the Critique of Political Economy introduction of the disjunction introduction of the implication introduction of the negation introduction risk of alien species introduction rule Introduction to Archival Informatization Construction Introduction to Aristotle's Categories Introduction to Bibliography Introduction to Bibliometrics Introduction to Bilingual Lexicography Introduction to Book Distribution Introduction to Chinese Quyi Introduction to Comparative Library Science Introduction to Dance Art Introduction to Dance Studies

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。