“直接晶圆键合技术”的概念、定义、翻译、参考文献-科学参考

单词	直接晶圆键合技术
释义	直接晶圆键合技术 Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	bronchiolitis bronchitis bronchodilator bronchopneumonia bronchoscope bronchoscopy bronchus Brong-Ahafo Region Bronislaw Huberman Bronislaw Kaspar Malinowski Bronk crater Bronowski Bronsted acid Bronsted base Bronsted concept of acids and bases brontograph brontothere Brontë crater bronze Bronze Age remains in Mongolia Bronze and Early Iron Age Archaeology in Korean Peninsula bronze and stele inscription school of painting bronze animal sculptures of Shang and Zhou dynasties bronze arms of steelyards with the inscription “Wang” bronze assemblages excavated from Chenggu and Yangxian

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。