“热压键合”的概念、定义、翻译、参考文献-科学参考

单词	热压键合
释义	热压键合 Encyclopedia 工学键合技术释 thermocompressive bonding热压键合两金属体（如金-金、铜-铜、铝-铝等相同的金属）在热和压力同时作用下进行原子级接触，通过原子的扩散运动实现键合的技术。又称扩散键合、压力键合。
随便看	Songze cultural pottery Songze Culture Song Zexing Song Zhangqing Song Zhanqian Song Zhenqi Song Zhidi Song Zhiwen Song Zhong Songzhuang Huajiacun Songzhu Temple Song Zihou Songzi Shi Song Ziwen Song Zizhen Song–Jin Peace Treaty of Jiading Era Sonia Gandhi sonic sonic agglomeration sonic analyzer sonic barrier sonic bonder sonic detection and ranging sonic detector sonic diffraction

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。