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热压键合
释义
热压键合
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工学
键合技术
释
thermocompressive bonding
热压键合
两金属体(如金-金、铜-铜、铝-铝等相同的金属)在热和压力同时作用下进行原子级接触,通过原子的扩散运动实现键合的技术。又称扩散键合、压力键合。
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multi-attribute utility/value theory,MAUT
multiaxial
multi-axial coils
multiaxial drawing
multiaxial fatigue
multi-axial flat knitting machine
multi-axial warp knitting machine
multiaxis
multi-axis CNC electrical discharge machining
multi axis differential optical absorption spectrometer
multi-band
multiband color-index
multiband photometer
multiband photometry
multi-banked cache
multi-bar Raschel machine
multi-barrier system
multi-bar warp knitted fabric
multibay truss
multibeam antenna
multibeam bathymetric survey system
multibeam echo sounding
multi-beam electron gun
Multi-beam Feed Array
multi-beam interference
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