请输入您要查询的字词:
单词
热压键合
释义
热压键合
Encyclopedia
工学
键合技术
释
thermocompressive bonding
热压键合
两金属体(如金-金、铜-铜、铝-铝等相同的金属)在热和压力同时作用下进行原子级接触,通过原子的扩散运动实现键合的技术。又称扩散键合、压力键合。
随便看
Volta crater
Volta effect
voltage
voltage amplifier
voltage amplifying tube
voltage amplitude
voltage bias
voltage calibrators
voltage characteristic
voltage clamp
voltage collapse
Voltage-Controlled Crystal Oscillator
voltage control oscillator
voltage divider
voltage divider, potentiometer
voltage-dividing network
voltage doubling rectifying circuit
voltage drop
voltage fed antenna
voltage feedback amplifier
voltage fluctuation
voltage-gated channel
voltage gated ion channel
voltage-gated ion channel
voltage-gated potassium channel
科学参考收录了854744条科技类词条,基本涵盖了常见科技类参考文献及英语词汇的翻译,是科学学习和研究的有利工具。
Copyright © 2000-2023 Sciref.net All Rights Reserved
京ICP备2021023879号
更新时间:2025/4/25 15:25:22