“热压键合”的概念、定义、翻译、参考文献-科学参考

单词	热压键合
释义	热压键合 Encyclopedia 工学键合技术释 thermocompressive bonding热压键合两金属体（如金-金、铜-铜、铝-铝等相同的金属）在热和压力同时作用下进行原子级接触，通过原子的扩散运动实现键合的技术。又称扩散键合、压力键合。
随便看	software capability maturity model software change report software confidentiality software configurability software configuration management software copyright software correctness software defect software defined architecture software defined data center software-defined data center software-defined enterprise software defined network software defined network, SDN software defined network,SDN software defined radio software-defined radio software defined security software defined storage software defined storage, SDS software defined threat software dependability software design software design methodology software design pattern

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