“晶圆键合”的概念、定义、翻译、参考文献-科学参考

单词	晶圆键合
释义	晶圆键合 Encyclopedia 工学键合技术释 wafer level bonding晶圆键合通过物理或化学的方法使晶圆片之间形成原子级的紧密结合，实现真空封装集成的键合技术。
随便看	Would Date Center system, Woulfe bottle wound wound ballistics wound cambium wound dressings wounded and disabled insurance wound healing wound hormone wound-rotor induction motor wound treatment biomechanics Wouthuysen-Field process woven woven bone woven fabric woven fabric perform woven fabric process design woven fabric quality woven garment woven-metal-mesh sand screen/premium screen woven substrate for synthetic leather wow Wowow WOWOW INC. Wo Xing Qi Ye

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。