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晶圆键合
释义
晶圆键合
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工学
键合技术
释
wafer level bonding
晶圆键合
通过物理或化学的方法使晶圆片之间形成原子级的紧密结合,实现真空封装集成的键合技术。
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Would Date Center system,
Woulfe bottle
wound
wound ballistics
wound cambium
wound dressings
wounded and disabled insurance
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wound treatment biomechanics
Wouthuysen-Field process
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woven bone
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woven fabric process design
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woven-metal-mesh sand screen/premium screen
woven substrate for synthetic leather
wow
Wowow
WOWOW INC.
Wo Xing Qi Ye
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