理学 计算机硬件电路 释 system in package; SIP 封装内系统 一种具有完整系统功能的多芯片封装形式。其中的硅片主要以垂直堆叠形式依托在衬底上，以缩小尺寸。
计算机硬件 计算机集成电路 释文 system in package, SiP 封装内系统
- super skew-symmetry
- superslice
- Super Soap
- supersociation
- supersoft X-ray source
- supersoft X-ray sources
- supersolid
- supersolidus liquid phase sintering
- supersolubility
- supersoluble
- supersoluble group
- supersolution
- supersolvability
- supersolvable
- supersolvable group
- supersolvable Lie algebra
- supersolvable Lie group
- supersonic
- supersonic (3S) separation process
- supersonic accretion
- supersonic aerodynamics
- supersonic air plasma spraying
- supersonic coagulation
- supersonic combustion
- supersonic combustion mode