工学 微纳机电系统 释 packaging 封装 把微纳裸芯片制造成微纳器件、组件模块、板卡，并最终组装成电子产品的整个过程。
capsulation 封装 encapsulation 密封，封装 jacketing 包壳，封装
软件工程 释文 encapsulation 封装
- Wang Tingzhen
- Wang Tiran
- Wang Tongyu
- Wang Tongzhao
- Wangtuiguan
- Wangtuiguan Type
- wangu
- Wan Guchan
- Wan Guoding
- Wan Guojun
- Wang villa in West Lake
- Wang Wan
- Wangwan
- Wang Wanping
- Wang Wanzhong
- Wang Wanzong
- Wang Wei
- Wang Weilie
- Wang Wei, Meng Haoran, Wei Yingwu and Liu Zongyuan
- Wang Weixin
- Wang Weiyi
- Wang Wen
- Wang Wenbin
- Wang Wenchong
- Wang Wenjuan