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圆片键合
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圆片键合
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wafer bonding
圆片键合
将两个具有不同晶向和晶格常量的完整的大尺寸平坦镜面的圆片所需要形成接触的区域一次性地通过物理化学方法连接起来,形成特殊功能或新材料性能,并保证接触区域具有足够的机械强度和合适的电子特性的一种半导体制造技术。
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flight control computer system
flight control of morphing flight vehicle
flight control of multi-rotor vehicle
flight control system
flight control system build in test
flight control system flight test
flight control system ground test with an aircraft
flight control system software
flight crew
flight crew emergency exits evacuation demonstration
Flight crew operation plan
flight data recorder systems
flight declination correction
flight delay
flight director system
flight dynamics of aircraft
flight envelope
flight fault detection
flight fault isolation
flight fault prediction
flight feather
flight hazardous weather
flight health management
flight height
flight illusion
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