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圆片键合
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wafer bonding
圆片键合
将两个具有不同晶向和晶格常量的完整的大尺寸平坦镜面的圆片所需要形成接触的区域一次性地通过物理化学方法连接起来,形成特殊功能或新材料性能,并保证接触区域具有足够的机械强度和合适的电子特性的一种半导体制造技术。
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exact row
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exact sampling theory
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EXAFS
exaggerated modify
Exaltation of the Holy Cross
examination
examinational and approval system for the admission of foreign investment
examination and approval by the People's Congress
examination and approval of budgets
examination and approval of forest tree variety
examination and approval system
examination and employing of civil servants
examination and evaluation of kidney disease
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