“倒装焊工艺”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊工艺
释义	倒装焊工艺 Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	photosynthetic electron transport photosynthetic induction response photosynthetic membrane photosynthetic nitrogen-use efficiency photosynthetic oxygen evolution photosynthetic phosphorylation photosynthetic pigment photosynthetic pigments photosynthetic potential productivity photosynthetic product photosynthetic productivity photosynthetic rate photosynthetic response photosynthetic type or pathway Photosynthetic water-use efficiency photosyntometer photosystem photosystems phototactic phototaxis phototelegram phototelegraph phototelegraphy phototelephone phototelephony

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。