“倒装焊工艺”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊工艺
释义	倒装焊工艺 Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	residual aberration residual analysis residual block design residual body residual boundary condition residual calculation residual category residual checking method residual claim residual class residual component residual control residual correlation residual coupling constant residual current residual current circuit breaker residual current operatedprotective devices residual curve residual data residual degree of freedom residual delay residual design residual dipolar coupling residual dipolar coupling (RDC) Residual Dividend Policy

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。