请输入您要查询的字词:
单词
倒装焊工艺
释义
倒装焊工艺
Encyclopedia
工学
【红外探测器工艺】
释
flip chip bonding technology
倒装焊工艺
通过倒装焊点(即金属凸点阵列)直接将元器件芯片倒扣在读出电路芯片或互连基板上,施加一定的压力使它们焊接在一起,实现元器件和读出电路或基板互连的工艺技术。
随便看
transit time effect
transit timing
transjugular intrahepatic portosystemic shunts
transketolase
translatability
translate
translated
Translated Literature
translated literature in modern China
translated text
translated work
translate of itself
translater
translating for water information telegram
translating machine
translating program
Translation
translation
translational
translational center cone inlet
translational control
translational corpus
translational definition
translational degree of freedom
translational entropy
科学参考收录了854744条科技类词条,基本涵盖了常见科技类参考文献及英语词汇的翻译,是科学学习和研究的有利工具。
Copyright © 2000-2023 Sciref.net All Rights Reserved
京ICP备2021023879号
更新时间:2024/7/2 17:42:44