“倒装焊工艺”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊工艺
释义	倒装焊工艺 Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	intrinsic defect; native defect intrinsic degree of freedom Intrinsic Development Theory intrinsic differential geometry intrinsic dispersion intrinsic distance intrinsic electric quadrupole moment intrinsic energy intrinsic equation intrinsic excitation intrinsic factor intrinsic Fermi level intrinsic frame of reference intrinsic G-connection intrinsic geometry intrinsic heart rate intrinsic homology intrinsic invariant intrinsic Josephson junction array radiation source intrinsic light intrinsic line capacitance intrinsic linewidth intrinsic luminosity intrinsic magnetic moment intrinsic magnetization

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。