“倒装焊工艺”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊工艺
释义	倒装焊工艺 Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	The Museum of the Yamen in Neixiang County The Museum of Xinjiang Production and Construction Corps The Museum of Yumen City The Music and Dance about Wishing the Emperor a Long Life The Music and Dance for Victory The Music and Dance in Chotscho Area The Music and Dance in Koryo Area The Music and Dance in Qiuci Area The Music and Dance in Xiliang Area The Music and Dance of Social Prosperity The Music and Dance of Wearing Rainbow-Coloured and Feathered Costumes The Music Bureau the music of causing country damage The Music of Man The Music of the Earth the music of the states of Zheng and Wei The Music Society for Chinese Ethnic Minorities the muti-pattern theory of mire development The Mysteries of Udolpho The Mystery of Picasso The Mystic Nine the myth about Queen Mother of the West The Mythical Stories of Bamboo Slips in Fangmatan The Myth of Sisyphus the myth of sovereign series

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。