“倒装焊工艺”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊工艺
释义	倒装焊工艺 Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	complete Abelian variety complete absorption complete accumulation point complete active space perturbation theory of second order complete active space perturbation theory of second order (CASPT2) complete active space SCF method complete active space self consistent field complete active space self-consistent field complete active space self consistent field (CASSCF) complete active space self-consistent field (CASSCF) complete additive family complete additive measure complete additivity complete additivity theorem complete algebra complete algebraic curve complete algebraic function complete algebraic system complete algebraic variety complete analytic family complete analytic function complete and cocomplete category Complete and Explicit Algorithm complete anesthesia complete angle

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。