“倒装焊工艺”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊工艺
释义	倒装焊工艺 Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	Banach-Jordan algebra Banach lattice Banach Lie group Banach limit Banach manifold Banach-Mazur compactum Banach-Mazur convergence theorem Banach-Mazur functional Banach-Mazur game Banach mean Banach measure Banach module Banach module (left, right, two-sided) Banach ring Banach-Saks property Banach Schauder theorem Banach-Schauder theorem Banach sequence space Banach space Banach space geometry Banach space theory Banach space with a base Banach star algebra Banach-Steinhaus theorem Banach-Stone theorem

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。