“倒装焊工艺”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊工艺
释义	倒装焊工艺 Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	backward differential equation backward differentiation formula backward Dini derivative backward effects backward elimination backward equation backward error backward error analysis backward Euler method backward induction backward interpolation backward interpolation formula backward Kolmogorov differential equations backward movement backward operator backward parabdic equation backward parabolic equations backward production capacity backward reachability backward reaction backward reasoning backward recovery backward scattering backward stability backward stochastic differential equation

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