“倒装焊工艺”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊工艺
释义	倒装焊工艺 Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	comp fil compg compilation compilation and analysis on monitoring data of hydraulic engineering compilation and authoring Compilation and Comparison of Laws of the Tang and Ming Dynasties Compilation by Cang Jie compilation catalogue compilation for charts Compilation for His Majesty's Reading Compilation of 100 Poem Collections of Late Tang and Five Dynasties Compilation of Acupuncture and Moxibustion on Selected Days Compilation of Ancient Chinese Characters compilation of archival documents Compilation of Archives on the Reunification of Taiwan in the Kangxi Era Compilation of Biographies of Painters Compilation of Calligraphy Compilation of Chinese Bronze Inscriptions Compilation of Chinese characters in the Warring States Period Compilation of Chinese-written Memorials to the Throne with the Emperor's Comments in Cinnarba-ink of the Kangxi Era Compilation of Chinese-written Memorials to the Throne with the Emperor's Comments in Cinnarba-ink of the Yongzheng Era Compilation of Chuanqi Stories from the Tang and Song Dynasties Compilation of Ci Poetry Collections of the Tang and Song Dynasties Compilation of Commentaries from the Song Dynasty on Poetry Compilation of Commentaries from the Song, Jurchen Jin and Yuan Dynasties on Ci Poetry

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。