“倒装焊工艺”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊工艺
释义	倒装焊工艺 Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	Gu Embroidery of the Ming Dynasty guenon Guenther Gueorgui Pinkhassov Guercino Guergahededaliya River Guericke Guericke crater Guericke, Otto von Guernica Guernsey Guerra Danon Feng Guerrilla girls Guerrilla in Academic Guerrillas on the Plain Guerrilla Theatre guerrilla warfare in mountains Gu Eryi guess-and-determine cryptanalysis Guess Guess Guess guessing guessing the minds of others with his own ideas Guess Who's Coming to Dinner guest guest and host

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。