“倒装焊工艺”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊工艺
释义	倒装焊工艺 Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	quantum well structure LED quantum wire quantum wires quantum XOR gate quantum Yang Baxter equation quantum Yang-Baxter equation quantum yield quantum yield of chemiluminescence quantum yield of fluorescence quantum Zeno effect Quan Yu Quan Yuanqi Quanzhen Taoism Quanzhen Taoist Authentic Rhyming Quanzhou Quanzhou Canal Quanzhou City Quanzhou city Quanzhou Confusion Temple Quanzhou Dacheng Opera Heritage Centre Quanzhou Donghu Park Quanzhou Gaojia Opera Troupe Quanzhou lunar new year woodblock prints Quanzhou Maritime Museum Quanzhou Museum

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