“倒装焊工艺”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊工艺
释义	倒装焊工艺 Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	Script for Storytelling of the Lushan Yuan Gong script for storytelling of the Song and Yuan Dynasties Script Holder script holder script kiddy script knowledge representation Script of Paying Respect to Deceased Nephew Jiming script order script outline script preparation script quantity scriptron Scripts and Letters of Li Bai Scripts of Shanghai-dialect Comic Talks Scripts of Yangzhou-dialect Storytelling script style script theme scriptural glosses Scripture of Great Peace Scripture of the Conversion of the Barbarians by Laozi Scripture of the Hidden Talisman Scripture of the Hymnal Rules of Lord Lao Scripture of the Jade Emperor Scripture of Western Ascension scRNA

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。