理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- parallel G-quadruplexstructure
- parallel graph algorithm
- parallel graphics algorithm
- parallel grouping
- parallel heading
- parallel hybrid
- parallel hybrid vehicle
- parallelian
- parallel import
- parallel inference machine
- paralleling
- parallel innovation
- parallel in the narrow sense
- parallel in the wider sense
- parallel in the wide sense
- parallel inverting circuit
- parallelism
- parallelism axiom
- parallelism class
- parallelism measurement
- parallelism of mind-body
- parallel iteration
- parallel iteration method
- parallelizability
- parallelizability of manifolds