理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- Cancún Summit
- candela
- candent
- candescence
- Candian Labour Union
- Candian Multicultrualism Act
- Candida antarctica
- candidacy of mid and low-level officials
- candidate
- candidate cloning
- candidate gene association study
- candidate of sciences
- candidate set
- candidatus
- Candida utilis
- candidiasis
- candidous
- candid photography
- candied fruit
- Candi Prambanan
- candle
- candle dance
- candle filter
- candle-flame star
- Candle In The Tomb