“倒装焊”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊
释义	倒装焊 Encyclopedia 理学计算机硬件电路释 flip chip倒装焊一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。 Computer 计算机硬件计算机集成电路释文 flip chip倒装焊
随便看	inclusion separation inclusion theorem inclusive inclusive cross-section inclusive design inclusive disjunction inclusive early childhood education inclusive economic institutions inclusive economic system inclusive education inclusive finance inclusive fitness inclusive growth inclusive innovation inclusive measurement inclusiveness inclusive offence inclusive OR inclusive OR-element inclusive predicates inclusive process inclusive urban planning incoagulable incoercible INCO flash smelting process

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。