“倒装焊”的概念、定义、翻译、参考文献-科学参考

单词	倒装焊
释义	倒装焊 Encyclopedia 理学计算机硬件电路释 flip chip倒装焊一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。 Computer 计算机硬件计算机集成电路释文 flip chip倒装焊
随便看	number of crimes number of crossings of a graph number of degree of freedom number of degrees of freedom number of divisors number of domestic tourists number of domination number of double points number of effective plates number of effective sperms number of eggs laid number of external stability number of faces number of figures number of floating point operations number of floating-point operations number of generators number of handles number of hydration number of inbound tourists number of independence number of internal stability number of inversions number of local moduli number of monofilaments

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。