理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- non-elastic scattering
- nonelastic scattering
- nonelastic scattering cross-section
- non-electric initiation
- non-electrolyte
- non-electrolyte solution theory
- nonelectrostatic force
- non-electrostatic [surface complexation] model
- non-elementary
- non-elliptic
- non-emptiness
- nonempty
- nonempty intersection
- non-empty model
- nonempty set
- nonempty subset
- Non endemic economy of ethnic minorities
- non-endo-non-exogenous cause
- non-engineering measures on drought mitigation
- Non-English Foreign Language Tests in China
- non-enumerability
- non-enumerable
- non-enumerable set
- non-environmental pollution feed
- non-enzyme browning reaction