理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- Weigel
- weigela
- Weigert effect
- weighable
- weigh bridge
- weighing
- weighing bottle
- weighing form
- weighing for multiple titrations
- weighing for single titration
- weighing instrument
- weighing-loading hopper
- weighing method
- weighing sensor
- weighing type metering device
- weight
- weight average molar mass
- weight-average molar mass
- weight average molecular weight
- weight-average molecular weight
- weight class
- weight decay
- weight-decay procedure
- weight decomposition
- weight detection