理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- astronomical nomenclature
- astronomical nutation
- astronomical observation
- astronomical observatory
- Astronomical Observatory of Trieste
- astronomical optical interferometry technology
- astronomical optics
- astronomical orientation
- astronomical phenomena
- astronomical phenomena hall
- astronomical photographic plate
- astronomical photography
- astronomical photometry
- astronomical plate
- astronomical point
- astronomical polarimetry
- astronomical pyrometer
- astronomical reference system
- astronomical refraction
- astronomical research
- astronomical satellite
- astronomical seeing
- astronomical sign
- Astronomical Society of Australia
- Astronomical Society of Japan