理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- intrinsic degree of freedom
- Intrinsic Development Theory
- intrinsic differential geometry
- intrinsic dispersion
- intrinsic distance
- intrinsic electric quadrupole moment
- intrinsic energy
- intrinsic equation
- intrinsic excitation
- intrinsic factor
- intrinsic Fermi level
- intrinsic frame of reference
- intrinsic G-connection
- intrinsic geometry
- intrinsic heart rate
- intrinsic homology
- intrinsic invariant
- intrinsic Josephson junction array radiation source
- intrinsic light
- intrinsic line capacitance
- intrinsic linewidth
- intrinsic luminosity
- intrinsic magnetic moment
- intrinsic magnetization
- intrinsic magnitude