“低热阻封装技术”的概念、定义、翻译、参考文献-科学参考

单词	低热阻封装技术
释义	低热阻封装技术 Encyclopedia 工学【边发射半导体激光器关键工艺】释 packaging process for low thermal resistance低热阻封装技术对半导体激光器进行散热封装，达到有效降低半导体激光器工作时的内部温度，以满足半导体激光器稳定、可靠、高效率工作目的的技术。
随便看	time diversity and combining time division duplex-long term evolution，TDD-LTE time division duplex-time division multiple access time division duplex-time division multiple access, TDD-TDMA time division multiple access time division multiple access, TDMA time division multiplex communication time division multiplexing time division multiplexing, TDM time division multiplexing，TDM time division-synchronous code division multiple access time division-synchronous code division multiple access, TD-SCDMA timed neutron time domain time domain airborne electromagnetic method time domain algorithm time domain analysis time-domain analysis time domain analysis of dynamic circuit time-domain and frequency-domain measurements time domain antenna time domain astronomy time domain coded optical coherence tomography time domain display time domain electromagnetic method

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。