“wire bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	wire bonding technology
释义	wire bonding technology Encyclopedia 工学【红外探测器工艺】释 wire bonding technology引线键合工艺芯片与芯片、芯片到基板、基板到基板或者基板到封装管壳的引线焊接技术。
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科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。