“wafer level packaging light emitting diode cutting”的概念、定义、翻译、参考文献-科学参考

单词	wafer level packaging light emitting diode cutting
释义	wafer level packaging light emitting diode cutting Encyclopedia 工学发光二极管封装工艺释 wafer level packaging light emitting diode cutting晶圆级封装发光二极管切割对发光二极管整个晶圆进行封装测试，再进行切割而得到单个成品芯片的工艺过程。
随便看	very high frequency omnidirectional range very-high resolution spectroscopy very-high-temperature reactor Very Large Array very large array very large array, VLA very large floating structures very large hadron collider very large scale integrated circuit very-large-scale integrated circuit very large scale integrated circuit, VLSI very-large-scale integrated circuit, VLSI very large-scale phenomenon Very Large Telescope Very Large Telescope Inteferometer very long baseline Very Long Baseline Array Very Long Baseline Interferometer very long baseline interferometer very long baseline interferometer, VLBI Very Long Baseline Interferometry very long instruction word very long instruction word processor very long instruction word processor, VLIW processor very long instruction word, VLIW

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