理学 计算机硬件电路 释 via hole 过孔 用于连接多层印制电路板内不同层导体的垂直连接孔。又称金属化孔。
计算机硬件 计算机工程制造 释文 via hole 过孔
- link layer protocol
- link manager
- link mechanism
- link module
- link of chain
- link order
- Linkou Taidi
- Linkou Xian
- link polynomial
- link prediction
- links curve
- link span
- link spread
- link state database
- link state packet
- link state packet, LSP
- link state protocol
- link test to spacecraft on Earth
- link-time optimization
- link type
- Lin Lan
- Lin Lan Xiang
- Lin Lanying
- Lin Li
- Lin Liang