工学 胶接 释 bonding 胶接 利用胶黏剂在连接面上产生的机械结合力、物理吸附力和化学键合力而使两个或两个以上胶接件连接起来的工艺方法。 工学 微纳机电系统 释 bonding 键合 通过化学和物理作用将硅片与硅片、硅片与玻璃片、金属与玻璃、金属与金属、塑性材料之间或其他材料之间紧密地结合起来的工艺方法。
凝聚态物理学 结构 bonding 成键 ＞原子与分子物理学＞原子分子的电子结构理论＞释义 bonding 成键 bonding ①成键†，键合 ②焊接 ③连接，结合
计算机硬件 计算机工程制造 释文 bonding 压焊
- partition function of orbifold
- partitioning
- partitioning algorithm
- partitioning and conditioning
- partitioning and relaxation algorithm
- partitioning and transmutation
- partitioning and transmutation (P&T; P-T)
- partitioning family of mappings
- partitioning function
- partitioning matrix
- partitioning method
- partitioning module
- partitioning procedure
- partitioning technique
- partitioning tree
- partition interface coupling solution
- partition into classes
- partition into squares
- partition into subsets
- partition lattice
- partition management of waters and shorelines
- partition number
- partition numerorum
- partition of a graph
- partition of a measure space