工学 胶接 释 bonding 胶接 利用胶黏剂在连接面上产生的机械结合力、物理吸附力和化学键合力而使两个或两个以上胶接件连接起来的工艺方法。 工学 微纳机电系统 释 bonding 键合 通过化学和物理作用将硅片与硅片、硅片与玻璃片、金属与玻璃、金属与金属、塑性材料之间或其他材料之间紧密地结合起来的工艺方法。
凝聚态物理学 结构 bonding 成键 ＞原子与分子物理学＞原子分子的电子结构理论＞释义 bonding 成键 bonding ①成键†，键合 ②焊接 ③连接，结合
计算机硬件 计算机工程制造 释文 bonding 压焊
- sCDM model
- Scd 型星系
- SCE
- Sceaux Park
- SCEC
- scedastic
- scedastic curve
- scedastic equation
- scedasticity
- scedastic line
- scedastic transformation
- SCEJ
- scelionids
- scenario analysis
- scenario analysis method
- Scenario analysis of environmental projection
- scenario based method
- scenario-based requirements modeling
- scenario development
- scenario forecasting method
- scenario of decision-making of mega project
- scenario planning
- scenario robust decision on mega project
- scenario-robustness on mega infrastructure engineering decision-making
- scenarios of land use planning