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microelectronic packaging
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microelectronic packaging
微电子组装
根据电原理图或逻辑图,运用微电子技术和高密度组装技术,将微电子器件和微小型元件组装成适用的、可生产的电子硬件的技术过程。
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insect-resistant and herbicide-tolerant genetically modified cotton T304-40
insect-resistant and herbicide-tolerant genetically modified maize 59122
insect-resistant and herbicide-tolerant genetically modified maize Bt11
insect-resistant and herbicide-tolerant genetically modified maize Bt176
insect-resistant and herbicide-tolerant genetically modified maize Mon88017×MON89034×TC1507×DAS-59122
insect-resistant and herbicide-tolerant genetically modified maize TC1507
insect resistant breeding for forage plants
insect-resistant genetically modified corn GK12
insect-resistant genetically modified corn JINMIAN38
insect-resistant genetically modified corn MON15985
insect-resistant genetically modified corn MON531
insect-resistant genetically modified cotton SGK321
insect-resistant genetically modified maize MIR162
insect-resistant genetically modified maize MIR604
insect-resistant genetically modified maize MON810
insect-resistant genetically modified maize MON863
insect-resistant genetically modified maize MON89034
Insect-resistant genetically modified rice Bt Shanyou 63
insect-resistant genetically modified rice Huahui1
insect-resistant genetically modified soybean MON87701
Insect-resistant transgenic
insect resistant wood-based panel
insects
Insects Awakening
Insect Science
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