“anodic bonding”的概念、定义、翻译、参考文献-科学参考

单词	anodic bonding
释义	anodic bonding Encyclopedia 工学［传感器制造］释 anodic bonding阳极键合将玻璃与金属、合金或半导体键合在一起，不用任何黏结剂的一种工艺技术。又称静电键合、静电封接。工学磁致动器释 anodic bonding阳极键合通过在硅片和玻璃之间施加强电场，形成很强的静电力，将两个表面紧密吸合在一起，使表面区域的大部分原子可以在一定温度下，形成硅-氧化学键（Si-O），从而使硅片和玻璃成为一个牢固的整体的技术。又称静电键合。
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