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flip chip bonding technology
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flip chip bonding technology
Encyclopedia
工学
【红外探测器工艺】
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flip chip bonding technology
倒装焊工艺
通过倒装焊点(即金属凸点阵列)直接将元器件芯片倒扣在读出电路芯片或互连基板上,施加一定的压力使它们焊接在一起,实现元器件和读出电路或基板互连的工艺技术。
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