“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	mine sustainable development minesweeper mine thermal harm mine transient electromagnetic instruments mine transient electromagnetic method mine transportation minette mine & tunnel rescue Mineur Mineur crater mine ventilation mine ventilation methods mine ventilation network mine ventilation system mine ventilation system design mine ventilator Mine Warfare mine wastewater bearing cyanide mine wastewater circulation utilization mine wastewater treatment mine water-bursting mine water environment mine water pouring mine waterproof mine water rescue system

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