“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	principal sphere of curvature principal square root principals' research leadership principal state model principal state of polarization principal's teaching leadership principal strain principal subgroup principal subgroup series principal submatrix principal submodule principal subspace principal surface principal symbol principal symbol sequence principal system principal tangent principal tangent bundle principal telescope principal term principal theorem principal trace principal translation principal two-sided ideal principal type

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