理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- coagulative sensitization
- coagulator
- coagulocyte
- coagulum
- Coahuila，Estado de
- coal
- coal-accumulating accommodation space
- coal-accumulating model
- coal-accumulating paleogeographic types
- coal-accumulating period
- coal-accumulating province
- coal accumulation
- coal-accumulation belt
- coal-accumulation center
- coal accumulation controlled by basin
- coal accumulation in highstand systems tract
- coal accumulation in lake transgressive systems tract
- coal accumulation in transgressive systems tract
- coal accumulation model for barrierless coast
- coal accumulation system
- coal alkylation
- coal and gas co-production
- coal and gas outburst
- coal and rock support machinery
- coal as fuel