理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- tip-tilt mirror
- tip-up door
- Tiqin opera
- Tiqin Opera Inheritance and Development Center of Chongyang County
- TIR
- Tirana
- Tirana Times
- Tiraspol
- tired light
- tired-light model
- tire explosion
- TIRFM
- TIR-FPL
- Tirgu-Jiu
- Tirgu Mures
- Tiroler Volkskunst-Museum
- Tirol Laments
- TIROS
- Tiros-1
- TIRS
- Tirupati
- TISA
- TISAB
- Ti-sapphire laser
- Ti:sapphire laser