理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- back scattering
- back-scattering
- backscattering
- backscattering analysis
- backscattering analysis, BSA
- back scattering-channeling effect
- back scattering method
- backscatter peak
- backscatter X-ray inspection technology
- backshaft
- backshift operator
- backshore subfacie
- back-shu point
- back-shu points and front-mu points combination，back-shu points and front-mu points association
- backside attack
- backside-illuminated CCD
- backside-illuminated CMOS
- back silting
- backslash
- backspring
- backstage bans and prohibitions
- backstage of Goulan (an open-air performance venue)
- backstage supervisor
- backstepping control
- backstepping design